质量与服务 质量与服务

质量与服务

Quality and Service

封装信息

 

BGA - Ball Grid Array

ECBGA - Embedded Chip Ball Grid Array

LGA - Land Grid Array

ECLGA - Embedded Chip Land Grid Array

MSOP - Miniature Small Outline Package

SOP - Small Outline Package

TSSOP - Thin Shrink Small Outline Package

SOT - Small Outline Transistor

TSOT - Thin Small Outline Transistor

TOXXX - Transistor Outline XXX

QFN - Quad/Dual Flat No Lead Package

TQFN - Thin Quad/Dual Flat No Lead Package

UTQFN - Ultra Thin Quad/Dual Flat No Lead Package

MQFN - IC in Module Quad/Dual Flat No Lead Package

QFP - Quad Flat Package

TQFP - Thin Quad Flat Package

LQFP - Low Profile Quad Flat Package

CSP - Chip Scale Package

WLCSP - Wafer Level Chip Scale Package

Module - Package With Component Integrated

PPD Module® - Peak Power Density Module